Ohashi Engineering is a mid-sized Japanese equipment manufacturer specializing in ACF bonding equipment. Based in a factory complex about an hour outside of Tokyo, Ohashi builds some of the world's most popular and successful ACF bonding lines and delivers them to places as diverse as the Ukraine and Brazil. Part of this success is because Ohashi's equipment is well-known for having the lowest total cost of ownership for high-volume lines, but this is only half the story.

Low Cost Tabletop Aligner/Bonder

The Ito Group TTAB-1008C is a tabletop aligner-bonder designed to be used in ACF repair operations, prototype labs, or other situations where the cost of manual labor is not critical. The TTAB-1008C is designed to manually align a single device to a single substrate by using micrometers and a set of cameras and displays. After alignment has been completed the machine immediately goes into the final bonding process, applying the preset time/heat/pressure profile required. Load, unload, and alignment are all performed by the operator.

MS-02

The MS-02 is a semi-automatic flip chip mounter for ACF assemblies. It features automatic alignment and the ability to integrate with other equipment in the Ohashi semi-automatic line. As with all Ohashi machines featuring the Common Carrier system, the MS-02 uses a carrier system to hold and load the substrates into the machine. Once started, the MS-02 then picks dies from waffle packs and automatically aligns and mounts them to all substrates on the carrier.