Ito America Corporation (IAC) based in Tempe, Arizona and located within the Arizona State University Flexible Display Center, is committed to the ongoing promotion of Anisotropic Conductive Film (ACF) and Ohashi Corporation ACF bonding equipment. One way that IAC helps do this is by hosting the Ito Group ACF Applications Lab.

The Lab is a convenient and economical way for companies to investigate the use of ACF without the expense of having to purchase capital equipment. The ACF Application Lab has the capabilities to process Flex-on-Flex (FOF), Flex-on-Glass (FOG), Flex-on-Board (FOB), Chip-on-Flex (COF), and Chip-on-Glass (COG) applications. People interested in any of these processes or technologies can contact the Lab to arrange demonstrations on eitehr standard test coupons or their own assemblies.

The ACF Applications Lab is furnished with equipment by Ohashi Corporation and currently consists of the following units:

1. TAJ-02 - FOG and FOF Alignment and Mounting System
2. CAJ-01 - COG and COF Alignment and Mounting System
3. HBM-10 - Constant Heat Bonder
4. OH-251 - Constant Heat Bonder (large substrate format, large pitch)
5. CBM-13 – Pulsed Heat Bonder (capable of fine pitch 60µm and greater)

As well as being able to offer the proper equipment for processing ACF, the Applications Lab also offers services such as design review, ACF selection, ACF cure rate analysis, cross-sectional analysis, general failure analysis, process optimization, and general design services.

To date, the Ito Group ACF Applications Lab has assisted well over thirty worldwide organizations with evaluation, assembly, prototype processing, and low volume production. The ACF Applications Lab is available for use in a variety of ways. To see how we can assist your organization's investigation of ACF, please enquire here or contact your local Ito Group representative through the appropriate contact page.