A low cost constant heat ACF bonder for medium and high volume applications.

The Ito Group TTAB-1008CR is a constant heat tabletop aligner-bonder featuring a rotary table to improve throughput. It also features a unique stage support mechanism which improves coplanarity and allows the machine to be used with complex 3D structures such as camera modules.

The TTAB-1008CR is designed to manually align a single device to a single substrate by using micrometers and a set of cameras and displays. After alignment has been completed the machine stage rotates so that the aligned assembly can be bonded while a second assembly is prepared. Load, unload, and alignment are all performed by the operator. 

The TTAB-1008CR is recommended for use in FOG, FOB, and FOF assembly and has a recommended minimum pitch of 0.2mm when using a 0.1/0.1mm line/space configuration.

Additional Features:

• Constant heat unit with PID thermal controller.
• Precision air cylinder with digital pressure regulator for fine pressure control.
• Rotary stage for high throughput and efficiency (TYP 275UPH)
• Bonding head size: MAX 100x8mm
• Designed for rapid tooling changeover.
• Features unique stage support mechanism, allowing complex 3D devices such as camera modules to be reliably assembled using ACF technology.
• Floating Carrier^TM capable.
• Comprehensive native English manual covering set-up, process development, maintenance, and operation.

Specification Sheet: Download PDF at our main corporate website.

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