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Written by Peter J. Opdahl
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Sunday, 24 January 2010 23:06 |
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MS-04
The MS-04 Device Mounter mounts multiple devices to a substrate or substrates loaded into its carrier. The substrate or substrates are loaded into a carrier and the carrier is then loaded into the MS-04. The operator then presses the start buttons and mounting occurs automatically using image recognition. After mounting is completed, this carrier is then transferred to the next process and the parts are bonded to complete the ACF assembly process.
The MS-04 features a mounting accuracy of ±20µm (3σ) using a flex-on-flex (FOF) or flex-on-board (FOB) assembly. Typical applications are for mounting a display module to a motherboard, a flex to a camera module, or a flex assembly to a motherboard. The MS-04 can be modified to work as flex-on-glass (FOG) mounter as well, in which case it can place flexes on displays, touch panels, or other transparent substrates.
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Written by Yukinori Urata
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Sunday, 24 January 2010 08:35 |
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LS-02
The LS-02, a semi-automatic ACF Laminator, is designed to attach multiple pieces of ACF at programmed positions in an XY array. The substrate or substrates are loaded into a carrier and the carrier is then loaded into the LS-02 laminator. The operator then presses the start buttons and ACF lamination occurs automatically. After ACF lamination, this carrier is then transferred to the next process and the substrate processing continues.
The LS-02 also has the ability to lay down two pieces of ACF simultaneously, doubling the throughput for applications such as camera modules.
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