This section lists all of the manual ACF bonding equipment that we sell. The categories below will allow you to choose between ACF Laminators, Mounters, and Bonders.
The Ito Group TTAB-1008C is a tabletop aligner-bonder designed to be used in ACF repair operations, prototype labs, or other situations where the cost of manual labor is not critical. The TTAB-1008C is designed to manually align a single device to a single substrate by using micrometers and a set of cameras and displays. After alignment has been completed the machine immediately goes into the final bonding process, applying the preset time/heat/pressure profile required. Load, unload, and alignment are all performed by the operator.
The Ohashi LD-02 is a compact tabletop single-site ACF laminator. Substrates are set by hand on the stage. The unit then laminates the programmed amount of ACF at the set location. This ACF laminator is suited for lab or prototype use, as well as for high-volume production in areas with low labor costs. By changing the stage design this unit can be used to laminate ACF on almost any substrate type. The overall unit was designed with simplicity in mind and allows set-up and adjustments to be done by operators of all levels.
The Ohashi BD-03 is a manual FOG/FOB/FOF aligner-bonder featuring constant heat and a Y-axis sliding stage. The substrate and FPC are placed on the stages and manually aligned with XY
θ micrometers before being bonded.
With 10+ years of production behind it, the BD-03 has a well-earned reputation for quality and stability. Its compact design allows two machines to be easily placed side-by-side and used by one operator. This machine is well-suited for lab or prototype use, as well as for high-volume production in areas where labor costs are not the primary concern.
The Ohashi BD-02 is a manual tabletop high precision pulsed heat bonder featuring a Y-axis sliding stage. The ceramic pulsed heating method allows for improved equipment durability, stability, and flexibility when compared to systems featuring metal heads. The use of a ceramic head allows for very flexible temperature control while maintaining accuracy and can be used in almost any ACF bonding application, including FOG, FOB, FOF, COG, COF, and COB.
The Ohashi BD-01 is a manual tabletop ACF bonder featuring constant heat and a Y-axis sliding stage. This machine provides highly accurate and economical ACF bonding in a compact form factor that is suited for lab or prototype use, as well as for high-volume production where labor costs are not the primary concern. The versatility of this machine allows it to be used in almost any ACF bonding application, including FOG, FOF, FOB, COG, COF, and COB.
Low Cost Tabletop Aligner/Bonder.jpg)
Ohashi LD-02 ACF Laminator
FPC Alignmer/Bonder
Pulsed Heat Bonder
Constant Heat Bonder