Ohashi HBM-10

If your organization is new to the world of Anisotropic Conductive Film (ACF) or possibly looking for an excellent and cost-effective entry level ACF bonder, then the Ohashi HBM-10 may be the solution your organization is looking for.

The Ohashi HBM-10 is a small versatile table-top style piece of equipment that is manually operated and suited for prototype assembly, R&D activities,  and low volume production. The beauty of this machine is the ease of operation, its process capabilities, and its short lead time. The Ohashi HBM-10 is capable of performing bonding on various substrates, including Flex-on-Flex (FOF), Flex-on-Glass (FOG), and Flex-on-Board (FOB). The typical minimum pitch we recommend this machine for is 100µm.

HBM-10 Specifications:

·         Table Size: Max. 230 x 180mm

·         Heat Tool Size: Max. 100 x 5mm

·         Temperature: Max. 300°C

·         Temperature Control: PID control

·         Overall Dimensions: 330(L) x 230(W) x 440(H)

·         Power Requirements: Single phase AC100-120V, 50/60Hz, 10A

For more information please enquire here or contact your local Ito Group representative through the appropriate contact page.