Low Cost Tabletop Aligner/Bonder

The Ito Group TTAB-1008C is a tabletop aligner-bonder designed to be used in ACF repair operations, prototype labs, or other situations where the cost of manual labor is not critical. The TTAB-1008C is designed to manually align a single device to a single substrate by using micrometers and a set of cameras and displays. After alignment has been completed the machine immediately goes into the final bonding process, applying the preset time/heat/pressure profile required. Load, unload, and alignment are all performed by the operator.

The TTAB-1008C is recommended for use in bonding FOG, FOB, and FOF bonding and has a recommended minimum pitch of 0.2mm when using a 0.1/0.1mm line/space configuration.

Specification Sheet: Download PDF