This section lists all of the semiautomatic ACF bonding equipment that we sell, including the best-selling Ohashi semiauto lines featuring their Common Carrier system. The categories below will allow you to choose between ACF Laminators, Mounters, and Bonders.
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Written by Tim Martinez
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Thursday, 04 February 2010 17:09 |
 FOG Mounter and Bonder
The Ohashi ME-01 is a high precision semi-automatic FPC mounter / bonder featuring auto-alignment. This equipment was designed for applications requiring high precision and reliability, such as medical devices. The use of automatic alignment and mounting assures that high quality is attained and maintained in production. This equipment is suited for medium to high volume production and the software has been designed to allow the ME-01 to be used for repair operations as well, improving utilization.
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Last Updated on Monday, 21 June 2010 23:48 |
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Written by Yukinori Urata
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Friday, 29 January 2010 09:11 |
.png) MS-02
The MS-02 is a semi-automatic flip chip mounter for ACF assemblies. It features automatic alignment and the ability to integrate with other equipment in the Ohashi semi-automatic line. As with all Ohashi machines featuring the Common Carrier system, the MS-02 uses a carrier system to hold and load the substrates into the machine. Once started, the MS-02 then picks dies from waffle packs and automatically aligns and mounts them to all substrates on the carrier.
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Last Updated on Monday, 21 June 2010 23:45 |
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Written by Peter J. Opdahl
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Sunday, 24 January 2010 23:23 |
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BS-03 Constant Heat Bonder
BS-04 Pulsed Heat Bonder
The BS-03/04 ACF Bonder equipment is the final piece of the Ohashi semi-automatic ACF bonding line. Using a line of 2-4 independently controlled bonding heads, the BS-03/04 equipment bonds each row of assemblies in the loaded carrier in a single cycle. Carriers with the mounted assemblies are loaded into the BS-03/04 and when the start button is pressed the machine moves the stage in the X-axis to bond the complete XY array of assemblies within the carrier. Each head has independent time, temperature, and pressure controlls, allowing this machine both very high throughput and reliabilty.
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Last Updated on Monday, 21 June 2010 23:45 |
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Written by Peter J. Opdahl
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Sunday, 24 January 2010 23:06 |
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MS-04
The MS-04 Device Mounter mounts multiple devices to a substrate or substrates loaded into its carrier. The substrate or substrates are loaded into a carrier and the carrier is then loaded into the MS-04. The operator then presses the start buttons and mounting occurs automatically using image recognition. After mounting is completed, this carrier is then transferred to the next process and the parts are bonded to complete the ACF assembly process.
The MS-04 features a mounting accuracy of ±20µm (3σ) using a flex-on-flex (FOF) or flex-on-board (FOB) assembly. Typical applications are for mounting a display module to a motherboard, a flex to a camera module, or a flex assembly to a motherboard. The MS-04 can be modified to work as flex-on-glass (FOG) mounter as well, in which case it can place flexes on displays, touch panels, or other transparent substrates.
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Last Updated on Monday, 21 June 2010 23:45 |
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Written by Yukinori Urata
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Sunday, 24 January 2010 08:35 |
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LS-02
The LS-02, a semi-automatic ACF Laminator, is designed to attach multiple pieces of ACF at programmed positions in an XY array. The substrate or substrates are loaded into a carrier and the carrier is then loaded into the LS-02 laminator. The operator then presses the start buttons and ACF lamination occurs automatically. After ACF lamination, this carrier is then transferred to the next process and the substrate processing continues.
The LS-02 also has the ability to lay down two pieces of ACF simultaneously, doubling the throughput for applications such as camera modules.
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Last Updated on Monday, 21 June 2010 23:42 |
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