MS-02

The MS-02 is a semi-automatic flip chip mounter for ACF assemblies. It features automatic alignment and the ability to integrate with other equipment in the Ohashi semi-automatic line. As with all Ohashi machines featuring the Common Carrier system, the MS-02 uses a carrier system to hold and load the substrates into the machine. Once started, the MS-02 then picks dies from waffle packs and automatically aligns and mounts them to all substrates on the carrier.

The MS-02 is a highly flexible addition to the Ohashi semi-automatic line and allows chip-on-glass (COG), chip-on-flex (COF), and chip-on-board (COB) assembly with only minor modifications to the optical system. The software system also allows multiple chips to be places on each substrate, and two different types of dies can be simulatenously loaded into the machine. The standard alignment and mounting tolerance is ±5µ, and ±4µm is available as an option.

General Specification Sheet: Download PDF