BS-03 Constant Heat Bonder
BS-04 Pulsed Heat Bonder

The BS-03/04 ACF Bonder equipment is the final piece of the Ohashi semi-automatic ACF bonding line. Using a line of 2-4 independently controlled bonding heads, the BS-03/04 equipment bonds each row of assemblies in the loaded carrier in a single cycle. Carriers with the mounted assemblies are loaded into the BS-03/04 and when the start button is pressed the machine moves the stage in the X-axis to bond the complete XY array of assemblies within the carrier. Each head has independent time, temperature, and pressure controlls, allowing this machine both very high throughput and reliability.

The difference between the BS-03 and BS-04 models is the way in which thermal energy is applied to the bond. The BS-03 uses the traditional constant heat bonding method where a cartridge heater is embedded into the head stack and thermal energy is transmitted through the head to the ACF assembly when it makes contact. As the head is always kept hot, this "constant heat" method provides a simple and cost-effective way of curing the ACF to repeatable level.

The BS-04 uses a pulsed heat system, which is more complex and more expensive. In the BS-04, the head is made of ceramic and is actively controlled during the bonding process to generate a thermal profile similar to what is seen in solder reflow ovens. This additional amount of control, while costing more, sometimes provides advantages in assembly reliability for complex assemblies such as for ACF camera module assemblies.

BS-03 Specification Sheet: Download PDF

BS-04 Specification Sheet: Download PDF